Global Ball Grid Array (BGA) PCB Companies Analysis 2025

On 2025-2-25, the latest report 【Global Ball Grid Array (BGA) PCB Market 2025 by Manufacturers, Regions, Types and Applications, Forecast to 2031】from Global Info Research provides a detailed and comprehensive analysis of the global Ball Grid Array (BGA) PCB market. The report provides both quantitative and qualitative analysis by manufacturers, regions and countries, types and applications. As the market is constantly changing, this report explores market competition, supply and demand trends, and key factors that are causing many market demand changes. The report also provides company profiles and product examples of some of the competitors, as well as market share estimates for some of the leading players in 2025.

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According to our (Global Info Research) latest study, the global Ball Grid Array (BGA) PCB market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a CAGR of %during review period.

The PCB used for placing the BGA components is known as BGA PCB. It contains similar connections, just like the ball grid array present on the back of the BGA package. The component is placed over the PCB and then soldered. After soldering, the package looks as if it is pasted on the board with glue. There are no leads or connections on the side of the BGA package, and it makes the PCB more reliable and offers many benefits.

According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.

This report is a detailed and comprehensive analysis for global Ball Grid Array (BGA) PCB market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approval.

Ball Grid Array (BGA) PCB market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type： Plastic Ball Grid Array、Ceramic Ball Grid Array、Tape Ball Grid Array、Enhanced Ball Grid Array、Flip Chip Ball Grid Array、Micro BGA

Market segment by Application：Consumer Electronics、Communications Industrial、Industrial、Others

Major players covered：Samsung Electro-Mechanics、Nanya PCB、TTM Technologies Inc.、Unimicron、Shennan Circuits、CMK Corporation、Kingboard、Creative Hi-tech Ltd.、Mer-Mar Electronics、JHYPCB、Multi Circuit Boards Ltd.、PCBAStore、Sierra Circuits、Cirexx、Pcbcart、RayMing、UCREATE ELECTRONIC GROUP

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Ball Grid Array (BGA) PCB product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Ball Grid Array (BGA) PCB, with price, sales quantity, revenue, and global market share of Ball Grid Array (BGA) PCB from 2020 to 2025.

Chapter 3, the Ball Grid Array (BGA) PCB competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Ball Grid Array (BGA) PCB breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment Ball Grid Array (BGA) PCB the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the Ball Grid Array (BGA) PCB sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2024.and Ball Grid Array (BGA) PCB market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Ball Grid Array (BGA) PCB.

Chapter 14 and 15, to describe Ball Grid Array (BGA) PCB sales channel, distributors, customers, research findings and conclusion.

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Ball Grid Array (BGA) PCB

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

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