Global E-Scrap and PCB E-Waste Market to Expand at 7.2% CAGR, Reaching USD 73.14 Billion by 2030

Global E-Scrap and PCB Recycling Market to Surpass USD 73.14 Billion by 2030, Driven by Sustainability and Technological Advancements

Summary: The global E-Scrap and Printed Circuit Board (PCB) recycling market is projected to grow at a compound annual growth rate (CAGR) of 7.2%, reaching an estimated USD 73.14 billion by 2030. This growth is fueled by increasing electronic waste generation, stringent environmental regulations, and advancements in recycling technologies.

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Market Size: In 2024, the E-Scrap and PCB recycling market was valued at approximately USD 43.82 billion. With a steady CAGR of 7.2%, the market is expected to reach USD 73.14 billion by 2030. This growth reflects the escalating demand for efficient e-waste management solutions globally.

Scope and Research Methodology: The market analysis encompasses various segments, including types of PCB e-scrap, sources of e-scrap, and materials recovered. Data was collected through primary and secondary research methods, ensuring a comprehensive understanding of market dynamics and trends.

Report Coverage:

• Types of PCB E-Scrap: Telecommunications Circuit Cards, Network Communication Boards, Circuit Packs, PC Motherboards.

• Sources of E-Scrap: Household Appliances, IT and Telecommunication Products, Entertainment Devices.

• Materials Recovered: Ferrous Components, Metals (Copper, Aluminum, Tin), Precious Metals (Gold, Silver, Palladium).

Market Overview: The surge in electronic device consumption has led to a significant increase in e-waste. PCBs, being integral to electronic devices, constitute a substantial portion of this waste. Their complex structure and valuable metal content make them a focal point for recycling efforts.

Market Dynamics:

• Drivers:

  • Rapid technological advancements leading to shorter device lifespans.

  • Growing awareness of environmental impacts of e-waste.

  • Government regulations promoting sustainable waste management practices.

• Challenges:

  • High costs associated with advanced recycling technologies.

  • Lack of standardized recycling processes across regions.

Segmentation:

• By PCB E-Scrap Type:

  • Telecommunications Circuit Cards

  • Network Communication Boards

  • Circuit Packs

  • PC Motherboards

• By Source of E-Scrap:

  • Household Appliances

  • IT and Telecommunication Products

  • Entertainment Devices

• By Material Recovered:

  • Ferrous Components

  • Metals (Copper, Aluminum, Tin)

  • Precious Metals (Gold, Silver, Palladium)

Key Players:

• Umicore N.V.

• LS-Nikko Copper Inc.

• Boliden Group

• Dowa Holdings Co. Ltd.

• Ultromext Ltd.

• GCL Recycling and Refining

• URT Recycling Technology

• Mairec

• Feeco International

• Qizheng

Reasons to Buy:

• Gain insights into market trends and forecasts up to 2030.

• Understand the impact of regulatory frameworks on market dynamics.

• Identify growth opportunities and strategic investment areas.

Table of Contents:

1. Executive Summary

2. Market Introduction

3. Research Methodology

4. Market Dynamics

5. Market Segmentation

6. Competitive Landscape

7. Regional Analysis

8. Future Outlook

9. Conclusion

10. Appendix 

For more information and to access the report, visit: https://www.maximizemarketresearch.com/market-report/global-e-scrap-and-printed-circuit-board-pcb-e-scrap-market/35153/ 

About Us: We are a leading market research and consulting firm, dedicated to providing in-depth analysis and strategic insights across various industries. Our team of experts leverages extensive research methodologies to deliver accurate and actionable market intelligence.

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