2.5D & 3D Semiconductor Packaging Market Growth Set to
Double by 2030

2.5D
& 3D Semiconductor Packaging Market Growth Trend & Forecast with latest research study
released by Delvens evaluating the market risk side analysis, highlighting
opportunities, and leveraging strategic and tactical decision-making support.
The report provides information on market trends and development, growth
drivers, technologies, and the changing investment structure of the Global market,
the global 2.5D & 3D Semiconductor Packaging Market size is projected to
reach a CAGR of 17.7% to Forecast 2030.

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Report: https://www.delvens.com/get-free-sample/2.5d-and-3d-semiconductor-packaging-market

The growth of the market is attributed to the growing
consumption of semiconductor devices across several industries. Additionally,
increasing demand for compact, high-functionality electronic devices is also
going to drive the market. Furthermore, the growing adoption of high-end
computing, servers, and data centers is going to provide the market with new
opportunities.

Recent Developments

·       
Shanghai Micro Electronics Equipment Group
(SMEE), a Shanghai-based company, announced that it had delivered China's first
advanced 2.5D/3D chip packaging stepper, which matches the advanced products in
the same category.

·       
South Korea's Samsung Electronics Co. unveiled a
new chip packaging technology called H-Cube, which stacks high-performance
chips in smaller sizes. The tech giant said that its latest 2.5D semiconductor
chip packaging technology is available for clients in artificial intelligence
(AI), data center, high-performance computing (HPC), and networking products
that require high-performance, large-area packaging.

Asia Pacific to
Dominate the Market         

·       
The increasing smartphone adoption rates have
made Asia-Pacific one of the largest mobile markets in the world due to factors
such as rising population, increasing disposable income, and growing
urbanization.

·       
Additionally, the region is projected to witness
rapid growth due to the increased demand for miniaturized circuits and the
presence of established semiconductor manufacturing companies, OEMs, and ODMs.

The Prominent Players
in the 2.5D & 3D Semiconductor Packaging
Market

·       
Amkor Technology

·       
ASE group

·       
Siliconware Precision Industries Co., Ltd.

·       
Jiangsu Changjiang Electronics Technology Co.
Ltd.

·       
SÜSS MicroTec AG.

·       
International Business Machines Corporation
(IBM)

·       
Intel Corporation

·       
Qualcomm Technologies, Inc.

·       
STMicroelectronics

·       
Taiwan Semiconductor Manufacturing Company and
More

The 2.5D & 3D
Semiconductor Packaging Market is segmented into various segments such as
packaging technology, end user, and region:

On the basis of
packaging technology

·       
3D Wafer-Level Chip-Scale Packaging (WLCSP)

·       
3D TSV

·       
5D

On the basis of end-user

·       
Consumer Electronics

·       
Aerospace and Defense

·       
Automotive

·       
Others

On the basis of
region

·       
Asia Pacific

·       
North America

·       
Europe

·       
South America

·       
Middle East & Africa

Access Full Report: https://www.delvens.com/report/2.5d-and-3d-semiconductor-packaging-market

In addition to the
market data for the 2.5D & 3D Semiconductor Packaging Market, Delvens
offers client-centric reports customized according to the company’s specific
demand and requirement.

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